Description
Product Overview
Overview
|
Order Code |
Sensor & Size (mm) |
Pixel(μm) |
G Sensitivity Dark Signal |
FPS/Resolution |
Binning |
Exposure |
| APC3TE4M2M1 | 4.2M/
GSENSE400BSI(M, UV) |
11 x 11 | 3.25×108 (e-/((W/m2).s)) Peak QE 95.3% @560nm345(e-/s/pix)68.5dB/50dB |
37@2048 x2048 37@1024 x1024 |
1×1 |
0.1ms~1000s |
Standard C-Mount camera with SONY Exmor or GSENSE CMOS sensors from 4.2M to 62M;
Big pixels or full-frame CMOS sensor;
Two-stage TE-cooling with controllable electric fan;
Sensor chip cooling up to-40°C below ambient temperature;
Working temperature can be regulated to specified temperature in 5 minutes;
Smart structure to assure the heat radiation efficiency and avoid the moisture problem;
IR-CUT/AR coated windows(Optional);
M52 x0.75 or C-mount;
USB3.0 5Gbit/second interface ensuring high speed data transmission;v
Up to 1000 seconds long time exposure;
Embedded up to 16bit hardware ISP module;
Including 2-D denoising and sharpening;
Ultra-FineTM color engine with perfect color reproduction capability;
Support the capture of video and image in software / hardware trigger mode;
With advanced video & image processing application ToupView;
Support both video and trigger modes;
Providing Windows/Linux/Mac OS multiple platforms SDK;
Native C/C++, C#/VB.NET, DirectShow, Twain control API;
C3 series camera adopts SONY Exmor or GSENSE with big pixel size or full-frame CMOS sensor as the image-picking device and USB3.0 is used as the transfer interface to increase the frame rate.
With the two-stage peltier cooling sensor chip to -40°C below ambient temperature. This will greatly increase the signal to noise ratio and decrease the image noise. Smart structure is designed to assure the heat radiation efficiency and avoid the moisture problem. Electric fan is used to increase the heat radiation speed.
C3 series comes with advanced video & image processing application ToupView; Providing Windows/Linux/OSX multiple platform SDK; Native C/C++, C#/VB.NET, DirectShow, Twain Control API;
The C3 series can be widely used in low light environment and microscope fluorescence image capture and analysis, as well as the astronomy deep sky application.
Interface Ports
USB 3.0 Port: 5Gb bandwidth ensures APC3TE4M2M1 high speed of 114@2016×1342.
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Mechanical Diagram
Installation drawings. The B3 body, the camera housing is made of hard aluminum alloy by CNC machining. The camera is designed with a high quality IR-CUT to protect the camera sensor. No moving parts included. This design ensures a rugged, robust solution with an increased lifespan when compared to other industrial camera solutions.
Items in The Packing Box
1. APC3TE4M2M1 Camera body 1
2. 2M USB3.0 Cable
Drivers and Softwares
Please install the newest camera drivers.
Sample Images
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